Integrated circuit having programmable voltage level line drivers and method of operation

ABSTRACT

There is disclosed, for use in an integrated circuit, an apparatus for driving a signal line in the integrated circuit. The apparatus comprises: 1) a line driver for receiving an incoming data signal and transmitting an outgoing data signal on the signal line; 2) a power source for supplying a plurality of power voltage levels to a power supply rail of the line driver; and 3) a power level controller for determining a data rate of the outgoing data signal and in response to the determination, selectively applying one of the plurality of power voltage levels to the power supply rail of the line driver to thereby modify an amplitude of the outgoing data signal.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present invention is related to those disclosed in U.S. patent application Ser. No. 09/796,660 filed concurrently herewith, entitled “REDUCED NOISE LINE DRIVERS AND METHOD OF OPERATION”.

The above application is commonly assigned to the assignee of the present invention. The disclosure of this related patent application is hereby incorporated by reference for all purposes as if fully set forth herein.

TECHNICAL FIELD OF THE INVENTION

The present invention is generally directed to system-on-a-chip (SOC) devices and, in particular, to a SOC device having programmable voltage level input-output (I/O) pads.

BACKGROUND OF THE INVENTION

In recent years, there have been great advancements in the speed, power, and complexity of integrated circuits, such as application specific integrated circuit (ASIC) chips, random access memory (RAM) chips, microprocessor (uP) chips, and the like. These advancements have made possible the development of system-on-a-chip (SOC) devices. A SOC device integrates into a single chip all (or nearly all) of the components of a complex electronic system, such as a wireless receiver (i.e., cell phone, a television receiver, and the like). SOC devices greatly reduce the size, cost, and power consumption of the system.

Reductions in power consumption are particularly important in SOC designs. SOC devices are frequently used in portable devices that operate on battery power. Since maximizing battery life is a critical objective in a portable device, it is essential to minimize the power consumption of SOC devices that may be used in the portable device. Furthermore, even if an SOC device is not used in a portable device, minimizing power consumption is still an important objective. The increased use of a wide variety of electronic products by consumers and businesses has caused corresponding increases in the electrical utility bills of homeowners and business operators. The increased use of electronic products also is a major contributor to the increased electrical demand that has caused highly publicized power shortages in California.

To minimize power consumption in electronic devices, particularly SOC devices, many manufacturers have reduced the voltage levels at which electronic components operate. Low power integrated circuit (IC) technology operating at +3.3 volts replaced IC technology operating at +5.0 volts. The +3.3 volt IC technology was, in turn, replaced by +1.6 volt IC technology in many applications, particularly microprocessor and memory applications.

However, reducing power supply levels also reduces performance. High frequency operations require higher voltage levels in order to rapidly switch signal lines from high to low, and vice versa. This frequently results in wasted power if an integrated circuit does not always operate at high speed. For example, during a period when only a relatively low level of processing power is needed, a high performance circuit that operates at +3.3 volts or higher will consume more energy than needed. Unfortunately, if the circuit is operated at +1.6 volts, the circuit will not be able to provide high-speed performance when it is required. Thus, circuit designers are often forced to make tradeoffs between power consumption and performance when selecting the operating speed and power supply levels of a device.

Therefore, there is a need in the art for system-on-a-chip (SOC) devices and other large scale integrated circuit devices that are capable of operating at high frequencies while minimizing power consumption. In particular, there is a need for SOC devices and other IC devices that are capable of switching to a low power mode when high performance is not required. More particularly, there is a need for SOC devices and other IC devices that are capable of varying power supply voltage levels to reduce power consumption when high performance is not required.

SUMMARY OF THE INVENTION

To address the above-discussed deficiencies of the prior art, it is a primary object of the present invention to provide, for use in an integrated circuit, an apparatus for driving a signal line in the integrated circuit. According to an advantageous embodiment of the present invention, the apparatus comprises: 1) a line driver capable of receiving an incoming data signal and transmitting an outgoing data signal on the signal line; 2) a power source capable of supplying a plurality of power voltage levels to a power supply rail of the line driver; and 3) a power level controller capable of determining a data rate of the outgoing data signal and in response to the determination, selectively applying one of the plurality of power voltage levels to the power supply rail of the line driver to thereby modify an amplitude of the outgoing data signal.

According to one embodiment of the present invention, the line driver comprises a complementary metal oxide silicon (CMOS) field effect transistor (FET) inverter.

According to another embodiment of the present invention, the power source supplies a low voltage power level substantially equal to +1.6 volts and a high voltage power level substantially equal to +3.3 volts.

According to still another embodiment of the present invention, the power level controller comprises a data processor capable of executing a power level control program stored in a memory coupled to the data processor.

According to yet another embodiment of the present invention, the power level controller further comprises a switch controlled by the data processor, wherein the switch selectively connects ones of the plurality of power voltage levels to the power supply rail in response to a switch control signal generated by the data processor.

In another advantageous embodiment of the present invention, the apparatus comprises: 1) a line driver capable of receiving an incoming data signal and transmitting an outgoing data signal on the signal line; 2) an adjustable power supply capable of generating an adjustable supply voltage that is applied to a power supply rail of the line driver; and 3) a power level controller capable of determining a data rate of the outgoing data signal and in response to the determination, adjusting the value of the adjustable supply voltage level applied to the power supply rail of the line driver to thereby modify an amplitude of the outgoing data signal.

In one embodiment of the present invention, the line driver comprises a complementary metal oxide silicon (CMOS) field effect transistor (FET) inverter.

In another embodiment of the present invention, the power supply generates an output voltage that is continually adjustable between a low voltage power level and a high voltage power level.

In still another embodiment of the present invention, the power level controller comprises a data processor capable of executing a power level control program stored in a memory coupled to the data processor.

In yet another embodiment of the present invention, the power level controller increases the value of the adjustable supply voltage level in response to a determination that the data rate of the outgoing data signal is relatively high.

In a further embodiment of the present invention, the power level controller decreases the value of the adjustable supply voltage level in response to a determination that the data rate of the outgoing data signal is relatively low.

The foregoing has outlined rather broadly the features and technical advantages of the present invention so that those skilled in the art may better understand the detailed description of the invention that follows. Additional features and advantages of the invention will be described hereinafter that form the subject of the claims of the invention. Those skilled in the art should appreciate that they may readily use the conception and the specific embodiment disclosed as a basis for modifying or designing other structures for carrying out the same purposes of the present invention. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the invention in its broadest form.

Before undertaking the DETAILED DESCRIPTION OF THE INVENTION below, it may be advantageous to set forth definitions of certain words and phrases used throughout this patent document: the terms “include” and “comprise,” as well as derivatives thereof, mean inclusion without limitation; the term “or,” is inclusive, meaning and/or; the phrases “associated with” and “associated therewith,” as well as derivatives thereof, may mean to include, be included within, interconnect with, contain, be contained within, connect to or with, couple to or with, be communicable with, cooperate with, interleave, juxtapose, be proximate to, be bound to or with, have, have a property of, or the like; and the term “controller” means any device, system or part thereof that controls at least one operation, such a device may be implemented in hardware, firmware or software, or some combination of at least two of the same. It should be noted that the functionality associated with any particular controller may be centralized or distributed, whether locally or remotely. Definitions for certain words and phrases are provided throughout this patent document, those of ordinary skill in the art should understand that in many, if not most instances, such definitions apply to prior, as well as future uses of such defined words and phrases.

BRIEF DESCRIPTION OF THE DRAWINGS

For a more complete understanding of the present invention, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, wherein like numbers designate like objects, and in which:

FIG. 1 illustrates a data processing system that comprises an exemplary system-on-a-chip (SOC) device according to one embodiment of the present invention;

FIG. 2 illustrates a high-level signal interface of the interconnection of exemplary split transaction, unidirectional bus interface (IF) unit and other bus devices in FIG. 1 according to the principles of the present invention;

FIG. 3 illustrates the signal interface which defines the interconnection of the exemplary bus IF unit, bus control processor, and one bus device in FIG. 2 in greater detail according to one embodiment of the present invention;

FIG. 4 illustrates exemplary power level adjusting circuitry according to one embodiment of the present invention;

FIG. 5 illustrates a variable voltage line driver in greater detail according to an exemplary embodiment of the present invention; and

FIG. 6 is a timing diagram of important signals illustrating the operation of the variable voltage line driver according to exemplary embodiments of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

FIGS. 1 through 6, discussed below, and the various embodiments used to describe the principles of the present invention in this patent document are by way of illustration only and should not be construed in any way to limit the scope of the invention. Those skilled in the art will understand that the principles of the present invention may be implemented in any suitably arranged data processing system.

FIG. 1 illustrates processing system 100, which comprises exemplary system-on-a-chip (SOC) device 105 according to one embodiment of the present invention. SOC device 105 is a single integrated circuit comprising processor core 110, graphics rendering block 120, (optional) display control circuit 130, memory 140, bandwidth matching-clock synchronization interface 150, peripheral interface 160, split transaction, unidirectional bus interface (IF) unit 170 (or bus IF unit 170), and bus control processor 180. Processor core 110 contains internal level one (L1) cache 115. Peripheral interface 160 communicates with external device 190.

Processing system 100 is shown in a general level of detail because it is intended to represent any one of a wide variety of electronic products, particularly consumer appliances. Display controller 130 is described above as optional because not all end-products require the use of a display. Likewise, graphics rendering block 120 may also be optional.

For example, processing system 100 may be a printer rendering system for use in a conventional laser printer. Processing system 100 also may represent selected portions of the video and audio compression-decompression circuitry of a video playback system, such as a video cassette recorder or a digital versatile disk (DVD) player. In another alternative embodiment, processing system 100 may comprise selected portions of a cable television set-top box or a stereo receiver.

Bus IF unit 170 provides high-speed, low latency communication paths between the components coupled to bus IF unit 170 Each component coupled to bus IF unit 170 is capable of initiating or servicing data requests via four unidirectional bus interfaces: two request buses and a two data buses. The request bus contains address lines, byte enable lines (32-bit or 64-bit data reads), cycle type lines, and routing information for transactions. The data bus contains data lines, byte enable lines (for data writes), completion status lines, and routing information to associate the data bus packets with the appropriate request bus packet. As noted, the four buses are unidirectional and point-to-point to minimize loading and timing variations. In addition, bus IF unit 170 provides a diagnostic bus, power management controls, clocks, reset signals, and a scan interface.

Bus IF unit 170 implements a transaction protocol that defines the mechanism for transferring packets between devices coupled to bus IF unit 170. In addition, the transaction protocol defines the control for clocks and power management. The packet protocol standardizes the system level interactions between devices coupled to bus IF unit 170. The hardware requirements for mapping transactions, arbitrating packets, and maintaining coherency is specified in the packet protocol.

Bandwidth matching-clock synchronization interface 150 comprise a queue that bridges ports on bus IF unit 170 that have different widths or different frequencies, or both. Bus control processor 180 controls certain operations of bus IF unit 170 related to clock timing, power management, and diagnostic features.

Peripheral interface 160 is a bus device used for chip-to-chip commination between SOC device 105 and an external peripheral device, such as external device 190.

FIG. 2 illustrates high-level signal interface 200, which defines the interconnection of exemplary split transaction, unidirectional bus interface (IF) unit and other bus devices in FIG. 1 according to the principles of the present invention. In the illustrative embodiment, a first split transaction, unidirectional bus interface unit (i.e., bus IF unit 170A) is coupled to, and transfers data between, memory 240, bus control processor 180, bus device 210A, bus device 210B, and a second split transaction, unidirectional bus interface unit (i.e., bus IF unit 170B). Bus IF unit 170B is coupled to, and transfers data between, bus devices 210C–210F, peripheral interface 260, and bus IF unit 170A.

In the illustrative embodiment, bus IF unit 170A uses separate interfaces to transfer data with bus device 210A, bus device 210B, bus control processor 180, and bus IF unit 170B. Each of the separate interfaces comprises four unidirectional buses. The unidirectional buses in each interface are REQUEST OUT, REQUEST IN (abbreviated REQ. OUT and REQ. IN, respectively), DATA OUT, and DATA IN. Similarly, bus IF unit 170B uses separate interfaces to transfer data with bus devices 210C–210F, peripheral interface 260, and bus IF unit 10A.

A data read request from a requesting one of bus devices 210A–210F is transmitted from bus IF unit 170A or bus IF unit 170B to a receiving one of bus devices 210A–210F that has the requested data via one of the REQUEST IN buses. The requested data is then transmitted out on the corresponding DATA OUT bus. Similarly, a write request from a requesting one of bus devices 210A–210F is transmitted from bus IF unit 170A or bus IF unit 170B to a receiving one of bus devices 210A–210F to which the data is to be written via one of the REQUEST IN buses. The incoming data is then received on the corresponding DATA IN bus. A requesting one of bus devices 210A–210F transmits read and write requests on the REQUEST OUT bus.

For example, bus device 210A may write data to bus device 210B by first transmitting to bus IF unit 170A a write data request on the REQUEST OUT bus coupling bus device 210A and bus IF unit 170A. Bus device 210A also transmits the write data to bus IF unit 170A on the DATA OUT bus coupling bus device 210A and bus IF unit 170A. Next, bus IF unit 170A transmits the write data request to bus device 210B on the REQUEST IN bus coupling bus device 210B and bus IF unit 170A. Bus IF unit 170A also transmits the write data to bus device 210B on the DATA IN bus coupling bus device 210B and bus IF unit 170A.

Furthermore, a bus device coupled to bus IF unit 170A can read data from, or write data to, a bus device coupled to bus IF unit 170B (including peripheral interface 260) via the four bus interface connecting bus IF unit 170A and bus IF unit 170B. Similarly, a bus device coupled to bus IF unit 170B (including peripheral interface 260) can read data from, or write data to, a bus device coupled to bus IF unit 170A via the four bus interface connecting bus IF unit 170A and bus IF unit 170B.

In the exemplary embodiment in FIG. 2, bus IF unit 170A is couple to memory 240 by only three buses, namely the REQUEST IN bus, the DATA OUT bus, and the DATA IN bus. A REQUEST OUT bus is not used to couple bus IF unit 170A and memory 240 because memory 240 does not normally initiate read operations and write operations.

FIG. 3 illustrates in greater detail signal interface 300, which defines the interconnection of bus IF unit 170A, bus control processor 180, and bus device 210A according to one embodiment of the present invention. As before, bus IF unit 170A is coupled to bus device 210A by four independent buses (REQUEST OUT, REQUEST IN, DATA OUT, and DATA IN). Bus IF unit 170A also is coupled to bus device 210A by several control signal lines, namely ASMI, ERR, and DIAGNOSTIC. Each port has an independent interface. Thus, there are no tri-state signal lines.

Bus device 210A initiates requests on the REQUEST OUT bus when bus device 210A operates as a master and receives requests on the REQUEST IN bus when bus device 210A operates as a slave. Write data and responses are initiated on the DATA OUT bus and transmitted to the target bus device (master or slave) on the DATA IN bus. All the buses have a similar control interface. The data bus width (e.g., 16 bits, 32 bits) may vary based on the bandwidth desired for a given application. The asynchronous system management interrupt (ASMI) signal provides a mechanism for bus device 210A to request a system management interrupt. The error (ERR) signal indicates an error that is not associated with a particular bus transfer.

Bus device 210A receives clock and reset (CLOCK/RESET) signal from bus control processor 180. Bus control processor 180 also provides control signals for performing scan, test, and/or built-in self test (BIST) functions. Optionally, bus device 210A may provide a DIAGNOSTIC bus that is coupled to bus IF unit 170A. The DIAGNOSTIC bus is group of important internal signals selected by the module designer. The DIAGNOSTIC bus may be multiplexed with diagnostic buses from other bus devices in bus IF unit 170A.

As is well known, the speed at which the components in SOC device 105 operate is determined in part by the voltage levels of the power supply rails in those components. A higher supply voltage drives larger currents through the transistors in the logic gates in the components in SOC device 105. This results in faster switching times and allows a higher operating frequency to be used. Unfortunately, a higher operating voltage also increases power consumption. This is particularly true with respect to data buses that interconnect, or are internal to, the components in SOC device 105. Long signal lines must be driven at relatively high voltages (and high power consumption) in order to switch rapidly between a high voltage (Logic 1) and a low voltage (Logic 0) during high frequency operations. However, when it is not necessary to operate at high frequency, a lower power supply voltage would be sufficient. In order to minimize the power consumed by the components of SOC device 105, including especially bus IF unit 170, peripheral interface 160, memory 140, and bandwidth matching-clock synchronization interface 150, the present invention provides a unique apparatus and a related method for adjusting the power supply voltage levels that are applied to selected line drivers in SOC device 105.

FIG. 4 illustrates power level adjusting circuitry, generally designated 400, according to one embodiment of the present invention. Power level adjusting circuitry 400 comprises variable level power sources 410, switch 420, variable voltage level line driver 430, processor core 110, and memory 140, which contains output voltage control program 440. Variable voltage level line driver 430 receives the unscaled DATA OUT signal and outputs a scaled DATA OUT signal. Variable voltage level line driver 430 is intended to represent any circuit that drives a data, address, or control line in SOC device 105. As will be discussed below in greater detail, the amplitude of the scaled DATA OUT signal may be adjusted according to the speed at which variable voltage level line driver 430 is operating. During times when variable voltage level line driver 430 is driving the scaled DATA OUT signal at high frequency, the voltage level of variable voltage level line driver 430 may be increased to, for example, +3.3 volts. During times when variable voltage level line driver 430 is driving the scaled DATA OUT signal at a relatively low frequency, the voltage level of variable voltage level line driver 430 may be decreased to, for example, +1.6 volts, thereby saving power.

Variable voltage level line driver 430 may be any one of a variety of known line driver circuits, such as an non-inverting buffer, or a simple inverter. For example, variable voltage level line driver 430 may be a conventional CMOS inverter comprising a P-type transistor and a N-type transistor. By selectively applying a smaller (e.g., +1.6 volts) or a larger (e.g., +3.3 volt) voltage to the power supply rail of the CMOS inverter, the switching speed of the CMOS inverter output can be decreased or increased.

Variable level power sources 410 represent a plurality of power supply voltages that may be generated on-chip (internally) by SOC device 105, or may be provided by external power supplies, or both. In the illustrated embodiment, the exemplary values of +3.3 volts and +1.6 volts are selected for purposes of illustration only. Those skilled in the art will recognize that other voltage levels may also be chosen.

According to one embodiment of the present invention, the variable power supply voltage may be selectively applied to variable voltage level line driver 430 by switch 420. This may be done adjustably by switching the variable power supply voltage between different discreet levels (i.e., +3.3 volts and +1.6 volts) using the SWITCH SELECT control signal from processor core 110. Alternatively, this may be done on a permanent basis (according to the specific application) when SOC device 105 is embedded in a circuit board and the position of switch 420 is selected by an external voltage coupled to the SWITCH SELECT control signal line.

In still another embodiment, the variable power supply voltage may be varied through a range of voltage levels by the LEVEL SELECT control signal. In such an embodiment, switch 420 (optionally) may be omitted and the output of variable voltage power sources 410 may be coupled directly to the power supply rail of variable voltage level line driver 430. The LEVEL SELECT control signal generated by processor core 110 may be a N-bit signal capable of adjusting the output of variable voltage power sources 410 to any one of 2^(N) voltage levels. Alternatively, the LEVEL SELECT control signal generated by processor core 110 may be an analog signal capable of adjusting the output of variable voltage power sources 410 to any level in a continuous range between a predetermined minimum level and a predetermined maximum value.

According to an advantageous embodiment of the present invention, processor core 110 sets the position of switch 420 using the SWITCH SELECT signal, or adjusts the output level of variable voltage power sources 410 using the LEVEL SELECT signal, by executing output voltage control program 440 stored in memory 440. Output voltage control program 440 may determine the appropriate voltage level on the scaled DATA OUT signal at the output of variable voltage level line driver 430 according to the frequency of the scaled DATA OUT signal. If variable voltage level line driver 430 must drive the scaled DATA OUT signal at a high data rate, output voltage control program 440 can increase the voltage level supplied to the power supply rail of variable voltage level line driver 430 by making an appropriate adjustment to the value of the LEVEL SELECT signal. When it is no longer necessary to drive the scaled DATA OUT signal at a high data rate, output voltage control program 440 can decrease the voltage level by adjusting the value of the LEVEL SELECT signal voltage, thereby saving power. It is noted that output voltage control program 440 need not be a stand alone program, but may instead be a sub-routine in a larger application program.

For example, if SOC device 105 is part of a cellular telephone and the scaled DATA OUT signal drives the transceiver portion of the cellular telephone, the voltage level supplied to the power supply rail of variable voltage level line driver 430 may be kept low during time periods when the cellular phone is accessing the wireless network but not actively conducting a phone call. During such an idle period, the cellular phone may only transmit intermittent acknowledgment signals at a low data rate to the wireless network to indicate that the cellular phone is still available on the network to receive calls. Since the data rate is low, output voltage control program 440, which may be part of the operating system program of the cellular phone, reduces power consumption by reducing the voltage on variable voltage level line driver 430. The unscaled DATA OUT signal is then driven at a lower bit rate.

However, at some point, the cellular phone may receive an incoming call or may initiate an outgoing call. When this occurs, output voltage control program 440 increases the power supply voltage applied to variable voltage level line driver 430 so that the scaled DATA OUT signal has faster switching times (i.e., faster rise times and faster fall times). The unscaled DATA OUT signal is accordingly driven at a higher bit rate to handle the voice and/or data traffic transmitted to the transmitter portion of the cellular phone.

The noise margins in SOC device 105 are determined in part by the voltage levels of the power supply rails therein. A lower supply voltage level reduces the noise margin in the components in SOC device 105. This reduced noise margin is adversely affected by, among other things, ground bounce and power supply noise caused by the ON-OFF switching of P-type and N-type transistors in line drivers in SOC device 105. In a complementary metal-oxide-silicon (CMOS) field effect transistor (FET) inverter driving a signal line, the P-type and N-type transistors of the CMOS inverter are both briefly ON during the transition from Logic 0 to Logic 1, and vice versa. This causes current spikes between ground and the power supply, resulting in noise. A rapid transition from Logic 0 to Logic 1 causes overshoots and ringing on the leading edge of a Logic 1 pulse. The present invention provides an improved line driver circuit capable of reducing the power supple noise and ground bounce in SOC device 105.

FIG. 5 illustrates variable voltage line driver 430 in greater detail according to an exemplary embodiment of the present invention. FIG. 6 is a timing diagram of important signals illustrating the operation of variable voltage line driver 430 according to exemplary embodiments of the present invention. Variable voltage line driver 430 comprises Logic 1 detector 510, Logic 0 detector 520, N-type transistor 530, and P-type transistor 540. P-type transistor 540 has a source coupled to the V_(DD) power supply rail and a drain coupled to the DATA OUT signal line. N-type transistor 530 has source coupled to ground and a drain coupled to the DATA OUT signal line.

P-type transistor 540 and N-type transistor 530 are connected similarly to a conventional CMOS inverter, except that the gates of P-type transistor 540 and N-type transistor 530 are not connected together. Instead, the gate of P-type transistor 540 (test point B) is coupled to the output of Logic 0 detector 520 and the gate of N-type transistor 530 is coupled to the output of Logic 1 detector 510. As will be described below in greater detail, variable voltage line driver 430 operates as an inverting line driver.

The critical feature of Logic 1 detector 510 is that it applies waveform A in FIG. 6 to the gate of N-type transistor 530 (test point A) in FIG. 5. Waveform A turns N-type transistor 530 slowly ON and rapidly OFF. The critical feature of Logic 0 detector 520 is that it applies waveform B in FIG. 6 to the gate of P-type transistor 540 (test point B) in FIG. 5. Waveform B turns P-type transistor 540 slowly ON and rapidly OFF. It is a further critical feature of the operations of Logic 1 detector 510 and Logic 0 detector 520 that N-type transistor 530 and P-type transistor 540 are never ON at the same time.

Those skilled in the art will recognize that the foregoing may be achieved in different ways, depending on the type of circuitry in Logic 1 detector 510 and Logic 0 detector 520. Logic 1 detector 510 and Logic 0 detector 520 may include delay elements that are triggered on transitions from Logic 0 to Logic 1, and vice versa. Alternatively, the waveform DATA IN may include guard barriers between Logic 1 periods and Logic 0 periods that prevent N-type transistor 530 and P-type transistor 540 are never ON at the same time.

In a first exemplary embodiment of the present invention, the DATA IN 1 signal in FIG. 6 is applied to the inputs of Logic 1 detector 510 and Logic 0 detector 520. In this first exemplary embodiment, Logic 1 detector 510 comprises a comparator that detects when the DATA IN 1 signal rises above a high threshold voltage. This is shown as a dotted line label Reference A (REF. A) in FIG. 6. Logic 0 detector 520 comprises a comparator that detects when the DATA IN 1 signal falls below a low threshold voltage. This is shown as a dotted line label Reference B (REF. B) in FIG. 6.

Initially, the DATA IN 1 signal is at a zero reference voltage (item 601) between the Reference A and Reference B levels. At this point, the output of Logic 1 detector 510 (waveform A) is at Logic 0 (item 621) and the output of Logic 0 detector 520 is at Logic 1 (item 631). Next, the DATA IN 1 signal goes to a Logic 1 by rising above the Reference A level (item 602). Logic 1 detector 510 detects the Logic 1 and the output of Logic 1 detector 510 ramps up relatively slowly (item 622) to a Logic 0 (item 623). The output of Logic 1 detector 510 turns on N-type transistor 530 and the DATA OUT signal, which is initially Logic 1 (item 641), ramps down (item 642) to Logic 0 (item 643). Since the output of Logic 1 detector 510 and the DATA OUT signal are not vertical pulses, overshoots and ringing caused by the leading edges of vertical pulse do not occur. This reduces noise in SOC device 105.

Next, the DATA IN 1 signal returns to the zero reference voltage (item 603) during a guard period (shown as delay period D2). Logic 1 detector 510 detects that the Logic 1 is gone and the output of Logic 1 detector 510 drops vertically to a Logic 0 (item 624). The output of Logic 1 detector 510 turns off N-type transistor 530 and the DATA OUT signal remains at Logic 0 (item 643) during delay period D2.

Next, the DATA IN 1 signal goes to a Logic 0 by falling below the Reference B level (item 604). Logic 0 detector 520 detects the Logic 0 and the output of Logic 0 detector 520 down relatively slowly (item 632) to a Logic 0 (item 633). The output of Logic 0 detector 520 turns on P-type transistor 540 and the DATA OUT signal ramps up (item 644) to Logic 1 again.

Those skilled in the art will recognize that Logic 1 detector 510 may use a number of different circuits to achieve a relatively slow ramp up from Logic 0 to Logic 1 and a rapid switch OFF from Logic 1 to Logic 0. For example, Logic 1 detector 510 may comprise an integrator circuit that is driven by a step function on the output of the comparator in Logic 1 detector 510. When the step output of the comparator goes from Logic 0 to Logic 1, the output of the integrator is a ramp function. An exemplary integrator may comprise a transistor that operates as a constant current source to charge a capacitor. The voltage on the capacitor is a ramp function whose slope varies in steepness according to the value of the capacitance. When the input to Logic 1 detector 510 switches from Logic 1 back to Logic 0, the output of the comparator may activate a switch that shorts the capacitor to ground. This causes a rapid transition from Logic 1 to Logic 0 at the output of Logic 1 detector 510.

Additionally, those skilled in the art will recognize that Logic 0 detector 520 may be implemented in a manner that is nearly identical to Logic 1 detector 510. The primary difference would be the inclusion of a final inverter stage at the output of Logic 0 detector 520.

In a second exemplary embodiment of the present invention, the DATA IN 2 signal in FIG. 6 may be applied to the inputs of Logic 1 detector 510 and Logic 0 detector 520. The DATA IN 2 signal does not include guard periods between Logic 1 and Logic 0 states. In this second exemplary embodiment, Logic 1 detector 510 comprises a comparator that detects when the DATA IN 2 signal rises above a zero reference voltage. This is shown as a dotted line label Reference C (REF. C) in FIG. 6. Logic 0 detector 520 comprises a comparator that detects when the DATA IN 2 signal falls below the Reference C (REF. C) level.

In this second exemplary embodiment, the DATA IN signal switches from Logic 0 to Logic 1, and vice versa with out a guard period. To prevent N-type transistor 530 and P-type transistor 540 from both being ON at the same time, Logic 0 detector 520 and Logic 1 detector 510 may comprise delay elements coupled to the outputs of the internal comparators that prevent the ramp up portions of waveform B and waveform B from occurring immediately after a Logic 0 to Logic 1 transition at the outputs of the comparators. This causes delay periods D1 and D2. The delay elements may be bypassed after a Logic 1 to Logic 0 transition at the outputs of the comparators in order to ensure that N-type transistor 530 and P-type transistor 540 turn OFF rapidly and without delay.

Although the present invention has been described in detail, those skilled in the art should understand that they can make various changes, substitutions and alterations herein without departing from the spirit and scope of the invention in its broadest form. 

1. An apparatus for driving a signal line comprising: a line driver capable of receiving an incoming data signal and transmitting an outgoing data signal on said signal line; a power source capable of supplying a plurality of power voltage levels; and a power level controller capable of determining a data rate of said outgoing data signal and in response to said determination, selectively applying one of said plurality of power voltage levels to a power supply rail of said line driver to thereby modify an amplitude of said outgoing data signal.
 2. The apparatus as set forth in claim 1 wherein said line driver comprises a complementary metal oxide silicon (CMOS) field effect transistor (FET) inverter.
 3. The apparatus as set forth in claim 1 wherein said power source supplies a low voltage power level substantially equal to +1.6 volts and a high voltage power level substantially equal to +3.3 volts.
 4. The apparatus as set forth in claim 1 wherein said power level controller comprises a data processor capable of executing a power level control program stored in a memory coupled to said data processor.
 5. The apparatus as set forth in claim 4 wherein said power level controller further comprises a switch controlled by said data processor, wherein said switch selectively connects ones of said plurality of power voltage levels to said power supply rail in response to a switch control signal generated by said data processor.
 6. The apparatus as set forth in claim 1, wherein said outgoing data signal comprises a digital signal.
 7. An apparatus for driving a signal line comprising: a line driver capable of receiving an incoming data signal and transmitting an outgoing data signal on said signal line; an adjustable power supply capable of generating an adjustable supply voltage that is applied to a power supply rail of said line driver; and a power level controller capable of determining a data rate of said outgoing data signal and in response to said determination, adjusting the value of said adjustable supply voltage applied to said power supply rail of said line driver to thereby modify an amplitude of said outgoing data signal.
 8. The apparatus as set forth in claim 7 wherein said line driver comprises a complementary metal oxide silicon (CMOS) field effect transistor (PET) inverter.
 9. The apparatus as set forth in claim 7 wherein said power supply generates an output voltage that is continually adjustable between a low voltage power level and a high voltage power level.
 10. The apparatus as set forth in claim 7 wherein said power level controller comprises a data processor capable of executing a power level control program stored in a memory coupled to said data processor.
 11. The apparatus as set forth in claim 10 wherein said power level controller increases said value of said adjustable supply voltage in response to a determination that said data rate of said outgoing data signal is relatively high.
 12. The apparatus as set forth in claim 11 wherein said power level controller decreases said value of said adjustable supply voltage in response to a determination that said data rate of said outgoing data signal is relatively low.
 13. The apparatus as set forth in claim 7, wherein said outgoing data signal comprises a digital signal.
 14. A system-on-a-chip (SOC) circuit comprising: a plurality of bus devices, each of said bus devices capable of transmitting data to a target one of said plurality of bus devices and receiving data from said target bus device; a bus interface unit coupled to each of said plurality of bus devices, wherein said bus interface unit is capable of transmitting data between said plurality of bus devices; a line driver disposed in at least one of said plurality of devices and said bus interface device, said line driver capable of receiving an incoming data signal and transmitting an outgoing data signal on a signal line in said SOC circuit; a power source capable of supplying a plurality of power voltage levels; and a power level controller capable of determining a data rate of said outgoing data signal and in response to said determination, selectively applying one of said plurality of power voltage levels to a power supply rail of said line driver to thereby modify an amplitude of said outgoing data signal.
 15. The SOC circuit as set forth in claim 14 wherein said line driver comprises a complementary metal oxide silicon (CMOS) field effect transistor (FET) inverter.
 16. The SOC circuit as set forth in claim 14 wherein said power source supplies a low voltage power level substantially equal to +1.6 volts and a high voltage power level substantially equal to +3.3 volts.
 17. The SOC circuit as set forth in claim 14 wherein said power level controller comprises a data processor capable of executing a power level control program stored in a memory coupled to said data processor.
 18. The SOC circuit as set forth in claim 17 wherein said power level controller further comprises a switch controlled by said data processor, wherein said switch selectively connects ones of said plurality of power voltage levels to said power supply rail in response to a switch control signal generated by said data processor.
 19. The SOC circuit as set forth in claim 14, wherein said outgoing data signal comprises a digital signal.
 20. A system-on-a-chip (SOC) circuit comprising: a plurality of bus devices, each of said bus devices capable of transmitting data to a target one of said plurality of bus devices and receiving data from said target bus device; a bus interface unit coupled to each of said plurality of bus devices, wherein said bus interface unit is capable of transmitting data between said plurality of bus devices; a line driver disposed in at least one of said plurality of devices and said bus interface device, said line driver capable of receiving an incoming data signal and transmitting an outgoing data signal on a signal line in said SOC circuit; an adjustable power supply capable of generating an adjustable supply voltage that is applied to a power supply rail of said line driver; and a power level controller capable of determining a data rate of said outgoing data signal and in response to said determination, adjusting the value of said adjustable supply voltage level applied to said power supply rail of said line driver to thereby modify an amplitude of said outgoing data signal.
 21. The SOC circuit as set forth in claim 20 wherein said line driver comprises a complementary metal oxide silicon (CMOS) field effect transistor (FET) inverter.
 22. The SOC circuit as set forth in claim 20 wherein said power supply generates an output voltage that is continually adjustable between a low voltage power level and a high voltage power level.
 23. The SOC circuit as set forth in claim 20 wherein said power level controller comprises a data processor capable of executing a power level control program stored in a memory coupled to said data processor.
 24. The SOC circuit as set forth in claim 23 wherein said power level controller increases said value of said adjustable supply voltage level in response to a determination that said data rate of said outgoing data signal is relatively high.
 25. The SOC circuit as set forth in claim 24 wherein said power level controller decreases said value of said adjustable supply voltage level in response to a determination that said data rate of said outgoing data signal is relatively low.
 26. The SOC circuit as set forth in claim 20, wherein said outgoing data signal comprises a digital signal.
 27. A method of driving a signal line comprising: generating a plurality of power voltage levels capable of being supplied to a power supply rail of a line driver driving the signal line with an outgoing data signal; determining a data rate of the outgoing data signal; in response to the determination, selectively applying one of the plurality of power voltage levels to the power supply rail of the line driver to thereby modify an amplitude of the outgoing data signal.
 28. The method as set forth in claim 27, wherein said outgoing data signal comprises a digital signal. 